Broadcom Corporation, a global innovation leader in semiconductor solutions for wired and wireless communications, has said on Monday that it has introduced the world’s first microwave outdoor unit (ODU) on a chip.

With unparalleled integration, the BCM85810 combines the functionality of up to 10 off-the-shelf chips, dramatically reducing the size, complexity, production cost and power consumption of microwave radio frequency units (RFUs).

Designed to address the need for higher bandwidth and faster time-to-market in microwave split-mount and full/all outdoor units (FODU/AODU), the BCM85810 RF system-on-a-chip (SoC) is based on a flexible architecture, enabling various types of system architectures such as split-mount (IDU-ODU) and all-outdoor (All-ODU) on a common hardware platform. With only two variants to cover all standard point-to-point microwave frequency bands and all channel bandwidths, the BCM85810 single chip solution simplifies system manufacturing, deployment, and inventory management. With support for high modulation, the BCM85810 delivers a significant improvement in spectrum utilization and capacity. 

The Company said that BCM85810 is now available with a complete reference design, system analysis and comprehensive development kit. 

“The introduction of our BCM85810 single chip solution marks the expansion of Broadcom’s microwave backhaul portfolio into the RF domain, as we have successfully done in multiple solutions including Wi-Fi, cellular, Bluetooth, and cable modems.The combination of our new RF solutions with our leading baseband solutions delivers a significant reduction in system size, cost and power consumption while dramatically improving system performance”, said Dan Charash, Senior Director & General Manager, Microwave, Broadcom Corporation.