Broadcom Corporation, a global innovation leader in semiconductor solutions for wired and wireless communications, has introduced its newest smartphone platform optimized for the Android 4.2 Jelly Bean operating system (OS).

Powered by the BCM21664T 1.2GHz HSPA+ cellular baseband, the 3G platform delivers strong performance capabilities at faster data speeds. The BCM21664T and its turnkey design features the industry’s first dual-core HSPA+ processor for affordable smartphones and integrates Broadcom’s leading connectivity suite, previously available only on higher-end Android devices.

Broadcom said that the appetite for affordable smartphones has grown in parallel to the demand for increased functionality and a superior mobile broadband experience that provides users with the ability to concurrently run apps, download files and share and stream content. The new BCM21664T platform brings together the processing power of a dual core ARM Cortex A9 with increased graphics and imaging capabilities to enhance the Android 4.2 experience. The chip is supported by radio frequency (RF), a power management unit (PMU) and an advanced connectivity suite for a complete system solution.

The BCM21664T is currently sampling with volume production expected in the first half of 2013.