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MediaTek announces the availability of multimode LTE modem chipset and other innovations at CES 2014
TT Correspondent |  |  07 Jan 2014

MediaTek is demonstrating its first LTE modem platform and wide range of other innovative technologies in IoT, Wearables and Home Entertainment space at the ongoing Consumer Electronics Show in US.

The MT6290 delivers LTE data rates as high as 150Mbit/s downlink and 50Mbit/s uplink. The chip implements FDD and TDD (Frequency Division Duplex and Time Division Duplex) modes of LTE for broad compatibility with mobile operator networks worldwide. In addition to LTE, the MT6290 also supports DC-HSPA+, W-CDMA, TD-SCDMA, EDGE and GSM/GPRS radio technologies.

The supporting RF chip in the platform is called MT6169 which supports up to 8 primary RF inputs (3 high bands, 2 mid bands, 3 low bands), plus another 8 RF inputs for diversity gains.  The RF chip supports more than 30 3GPP bands and is configurable to meet the RF band needs of mobile operators globally.

“We are pleased to unveil our first LTE modem platform at the CES show and seek to create a global market of mainstream LTE devices in collaboration with our mobile operator partners.” said Cheng-Te Chuang, Head of Wireless Communications Technology Businesses Unit and Vice President of MediaTek. “The MT6290 is fully-compatible with the presently-available 3G mobile SOCs from MediaTek and our next-generation SOCs with LTE integration will be sampling throughout 2014.”

Mohit Bhushan, VP/GM of MediaTek Corporate Marketing, USA, said: “MediaTek has shared its LTE plans with all US operators, and the response has been terrific. We are now preparing to certify the MT6290 platform with all US operators followed by the commercialization of MT6290-enabled data devices within 2014”.

The MT6290 reference design has already been delivered to MediaTek’s early-adopter OEM partners and the first commercial devices are expected in Q2 2014.

Besides LTE modem, MediaTek is also demonstrating a wide range of other innovative products and technologies at CES including mobile SOCs, new Home Entertainment, Connectivity, Wireless Charging and Internet of Things solutions.

Mobile SOCs
Complemented by a highly optimized ARM big.LITTLE processing subsystem, MediaTek MT8135 is an advanced mobile SOC designed for high-end tablets.

Launched in November 2013, MediaTek MT6592 is the world’s first heterogeneous computing SOC with scalable eight-core processing for superior multi-tasking, industry-leading multimedia and excellent performance-per-watt.

Home Entertainment
As the world’s first Ultra HD (4K2K) DTV SOC with 60Hz HEVC support, the MediaTek SOC begins sampling in Q2 2014.

Connectivity
Already available, MediaTek MT7621A is a new dual-core 11ac Wi-Fi router platform with various hardware acceleration features designed as a universal foundation for a range of applications. MT7621A serves as a getaway for Wi-Fi Certified Passpoint™ technology and its secure automated entry of user credentials for public wireless hotspots.

Wireless Charging
World’s first multimode inductive Qi and resonance wireless charging SOC is making its industry debut at CES 2014.

Wearables
MediaTek presents the all-in-one solution for wearables, Aster. It is not only the smallest SOC with high integration, but provides also a comprehensive Application Framework, MRE (MediaTek Run-time Environment) that allows users to install and upgrade APPs.

Internet of Things
Cloud applications, video over Wi-Fi (VoW), indoor positioning and smart home automation.

    
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07 Jan 2014(IST)  
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