Huawei Technologies claimed success in delivering downlink data rate of 42 Mbps over dual carrier HSPA+ technology along with technological partner, Qualcomm.

The test saw the use of Huawei’s latest HSPA+ solution and Qualcomm’s Mobile Data Modem™ (MDM) MDM8220™ chipsets over a dual cell technology platform. The solution transmits data via two or more carriers ultimately resulting in making optimum use of spectrum with up to 20 enhancements in spectral efficiency and capacity gains.

“Qualcomm is pleased to be working with Huawei to bring dual-carrier HSPA+ technologies to market,” said Alex Katouzian, vice president of product management, Qualcomm CDMA Technologies. “We remain committed to WCDMA modem leadership and the seamless and cost-effective commercialization of next-generation technologies around the world.”

Wan Biao, President of Wireless, Huawei, said, “Achieving higher speeds is a constant pursuit for customers and their subscribers. As a customer-centric company, Huawei is dedicated to developing innovative technology and cost-effective solutions and services. In cooperation with Qualcomm, we are able to deliver the latest in commercially available mobile broadband technology and user devices.”

Last year Huawei deployed Asia Pacific’s first 21 Mbps HSPA+ commercial network as well as 56 Mbps commercial solution demonstration in Beijing. The company now plans to provide solution to deliver 28 Mbps HSPA+ commercial service in Singapore.