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Qualcomm starts shipments of its dual-CPU snapdragon chipsets
TT Correspondent |  Mumbai |  03 Jun 2010

Chipmaker for the wireless industry, Qualcomm announced that it has sampled and sahipped its first dual-CPU Snapdragon chipsets, the Mobile Station Modem (MSM) MSM8260 and MSM8660 solutions capable of running at up to 1.2 GHz.

“Qualcomm’s first-generation Snapdragon chipsets set a new standard for advanced smartphones and smartbook devices, and our second-generation solutions are already shipping in volume,” said Steve Mollenkopf, executive vice president of Qualcomm and president of Qualcomm CDMA Technologies.  “We are very excited by the innovation our customers are already showing as they begin designing products based on our dual-core MSM8260 and MSM8660 chipsets.”

The MSM8260 is HSPA + compatible while the MSM8660 is multimode and compatible with HSPA+/CDMA2000 1xEV-DO Rev.B.

The Snapdragon family includes first-generation QSD8x50 with 1GHz enhanced core, second-generation MSM8x55 and QSD8x50A with 1GHz enhanced core, including multimedia optimizations and 1.3GHz enhanced core, respectively and third-generation products MSM8260, MSM8660 and QSD8672 with dual-CPU architecture featuring enhanced cores running at up to 1.2GHz and 1.5GHz, respectively.

    
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03 Jun 2010(IST)  
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